Sunday, 24.08.2025
- Individual arrival and check-in
- Reception and getting to know each other
Monday, 25.08.2025
| Session 1 | Materials Innovation for Microprinting | ||
|---|---|---|---|
| 08:45 | Opening remarks | ||
| T1 | 09:00 | Daniel Corzo Silicon Austria Labs, Austria |
From Molecule to Microscale: Sustainable Ink Formulation for functional printing |
| T2 | 09:30 | Jessica Zamarripa Texas A&M University, College Station, TX, USA |
Deposition Study Towards High Cyclic Liquid Metal-Based Circuits Applied to Shape Memory Material Substrates |
| T3 | 09:45 | Sven Hujo DELO, Windach, Germany |
Investigation of Electrically Conductive Adhesives for Miniaturized SMD Components |
| T4 | 10:00 | Sarah Hoffmann KIT, Karlsruhe, Germany |
Polymer Electrolyte Membrane Fuel Cell Gas Diffusion Layers as an Application for Microprinting |
| 10:15 | Break |
| Session 2 | Emerging Microstructure Printing Techniques – Part I | ||
|---|---|---|---|
| T5 | 10:45 | Stefanie Hartmann Sonojet, Dresden, Germany |
Surface-acoustic-wave (SAW) based aerosol sources for next-generation microprinting |
| T6 | 11:15 | Shingo Oshima Komori Corporation, Tsukuba, Japan |
Solder and Cu micro-printing technology by gravure offset |
| T7 | 11:30 | Tuncay Alan Monash University, Melbourne, Australia |
Oscillating Microchannel-Based Atomization for High Precision Tunable Aerosol Printing |
| T8 | 11:45 | Simone Santucci ATLANT 3D, Taastrup, Denmark |
Micro-Direct Atomic Layer Processing (DALP™): Scalable, Localized Thin Film Printing for Next-Generation Microstructures |
| 12:00 | Lunch Break |
| Session 3 | Future Applications: Biotechnology | ||
|---|---|---|---|
| T9 | 13:30 | Michael Gelinsky TU Dresden, Germany |
Combining materials, cell types and technologies for bioprinting of complex tissue models |
| T10 | 14:00 | Daniel Kranz HTW Dresden, Germany |
Biobased and Biodegradable Sensors for Monitoring of Temperature, Strain and Humidity |
| T11 | 14:15 | Kai Mattern Fraunhofer IZI, Leipzig, Germany |
Additive Manufacturing for the Cost-Efficient Development of High-Resolution, Point-of-Care Diagnostic Systems |
| T12 | 14:30 | Amlan Ashish Indian Institute of Technology, Kharagpur, India |
3D-Printed Microfluidic Device for Biological Application |
| T13 | 14:45 | Spencer Moore IPF Dresden, Germany |
Direct Ink Writing for prototyping of soft, multimodal and tailored bioelectronic interfaces |
| 15:00 | Announcement + Company Pitches |
| 15:30 | Poster & Company Session (with coffee) |
| 18:00 | BBQ |
Tuesday, 26.08.2025
| Session 4 | Scaling of Microprinting – Part I | ||
|---|---|---|---|
| 08:45 | Announcements | ||
| T14 | 09:00 | Kai Keller Notion Systems, Schwetzingen, Germany |
Making an impact: Scaling digital, additive processes into electronics production |
| T15 | 09:30 | Steffen Günther Fraunhofer FEP, Dresden, Germany |
Roll-to-roll Nano-Imprinting Processes for Functional Surfaces Using Electron Beam Crosslinking |
| T16 | 09:45 | John Fahlteich KETMarket, Dresden, Germany |
From Lab to Market – Accelerating innovation and technology transfer! |
| T17 | 10:00 | Jaakko Leppäniemi VTT, Espoo, Finland |
Scalable High-Resolution Printed Electronics with Reverse Offset |
| 10:15 | Break |
| Session 5 | Future Applications: Microfluidics and Sensors | ||
|---|---|---|---|
| T18 | 10:45 | Gregory P. Nordin Brigham Young University, Provo, UT, USA |
Redefining Microfluidics: The Power of Advanced 3D Printing |
| T19 | 11:15 | Claudia Hackl UFZ, Leipzig, Germany |
Printed microfluidic membrane reactor for in-situ product recovery |
| T20 | 11:30 | Muhammad Usman Akhtar TU Munich, Germany |
3D printing of structured micro-particles with multifunctional materials for multiplex immunoassay |
| T21 | 11:45 | Ayako Yoshida Yamagata University, Japan |
Development of Sustainable and High-Performance Sensor Systems Using Printing Technology |
| 12:00 | Lunch Break |
| Session 6 | Emerging Microstructure Printing Techniques – Part II | ||
|---|---|---|---|
| T22 | 13:30 | Masoud Mahjouri-Samani NanoPrintek, Auburn, AL, USA |
Inkless multimaterial printing of electronics and functional devices |
| T23 | 14:00 | Uwe Scheithauer Fraunhofer IKTS, Dresden, Germany |
Additive Manufacturing of (multi-material) ceramics opens the door to components with high functionality |
| T24 | 14:15 | Nina Szczotka XTPL, Wrocław, Poland |
Digital Microprinting with Ultra-Precise Dispensing (UPD) Technology: Precision Solutions for Microelectronics and Displays |
| T25 | 14:30 | Sahar Al Kamand Hummink, Paris, France |
HPCaP Redefines Precision in Microstructure Printing |
| 15:00 | Hiking tour in Saxonian Switzerland |
| 19:00 | Conference Dinner and Poster Award |
Wednesday, 27.08.2025
| Session 7 | Scaling of Microprinting – Part II | ||
|---|---|---|---|
| T26 | 09:00 | Sebastian Gepp Kundisch, Villingen-Schwenningen, Germany |
High Yield production in printed electronics- route to success |
| T27 | 09:30 | Robert Kirchner HETEROMERGE, Dresden, Germany |
In situ multi-material 3D printing of rigid and compliant materials using 2-photon-polymerization |
| T28 | 09:45 | N/A | (tbc) |
| T29 | 10:00 | Frank Roscher Fraunhofer ENAS, Chemnitz, Germany |
Additive deposition technologies: from 2D towards 3D electronic systems |
| 10:15 | Break + Room Check-out til 11 |
| Session 8 | Future Applications enabled by 3D Printing | ||
|---|---|---|---|
| T30 | 11:00 | Callum Vidler University of Melbourne, Melbourne, Australia |
From Interface to Impact: Accelerating 3D Biofabrication through Dynamic Interface Printing |
| T31 | 11:30 | N/A | (tbc) |
| T32 | 11:45 | Sophie Suijdendorp TNO at Holst Centre, Eindhoven, The Netherlands |
Freeform 3D Microelectronics and Packaging by Additive Micro-Manufacturing |
| T33 | 12:00 | Ulrich Trog JOANNEUM Research, Weiz, Austria |
New inhibition technology for (Pt)-cured silicones to enable 3D printing |
| 12:15 | Closing remarks |
| 12:45 | Lunch Break |
Poster Session
| Poster | Author | Title | |
|---|---|---|---|
| P1 | Christoph Folgner HZDR, Dresden, Germany |
Silicon Fleece Anodes as Components of Lithium-Ion Batteries | |
| P2 | Shingo Oshima Komori Corporation, Japan |
Next-gen printing for high precision and mass production | |
| P3 | Konrad Bethmann Leibniz University Hannover, Germany |
Inverse design of robust out-of-plane elements | |
| P4 | Nico Arnold IFTE / TU Dresden, Germany |
Please, Fold the Line: Designing Flexible Electronics Using Open-Source Software | |
| P5 | Raouf Belloum HZDR, Dresden, Germany |
Enhancing Inkjet Print Quality of Metal-Organic Decomposition Ink on Glass Surfaces | |
| P6 | Anete Berzina University of Latvia, Riga, Latvia |
Inkjet printing for integrated heterogeneous photonics | |
| P7 | Tadahiro Furukawa Yamagata University, Japan |
Conductive Inks for Thermoforming and Molding Conditions | |
| P8 | Yannik Mahlau Leibniz University Hannover, Germany |
FDTDX: Electromagnetic Simulation and Inverse Design of Nanophotonic Structures | |
| P9 | Alexander Blümel JOANNEUM Research, Austria |
Aerosol Jet Printing and Capillary Assisted Inkjet Printing as High Resolution Deposition Techniques for Fabrication of Electrodes in Microfluidic Applications |